"discountType": "%",
以600mm×600mm面板为例，其面积是12英寸晶圆载板的5.1倍，单片产出芯片数量大幅增加。同时，FOPLP的面积利用率超95%，显著优于传统晶圆级封装的85%，同等面积下面板可多容纳1.64倍芯片。基板面积增大持续降低成本，200mm向300mm过渡节约25%成本，300mm向板级封装过渡更可节约66%成本。
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Wallace had been seeking up to £10,000 in damages from the BBC, but court documents state the claim against the BBC and BBC Studios has been "discontinued".，详情可参考爱思助手下载最新版本
Test constant: A 6-bit identifier from the microcode that tells the PLA what kind of check to perform.
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